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| PD - 96161 IRLML6402GPbF l l l l l l l l Ultra Low On-Resistance P-Channel MOSFET SOT-23 Footprint Low Profile (<1.1mm) Available in Tape and Reel Fast Switching Lead-Free Halogen-Free HEXFET(R) Power MOSFET D VDSS = -20V G S RDS(on) = 0.065 Description These P-Channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET(R) power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in battery and load management. A thermally enhanced large pad leadframe has been incorporated into the standard SOT-23 package to produce a HEXFET Power MOSFET with the industry's smallest footprint. This package, dubbed the Micro3TM, is ideal for applications where printed circuit board space is at a premium. The low profile (<1.1mm) of the Micro3 allows it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards. The thermal resistance and power dissipation are the best available. Micro3TM Absolute Maximum Ratings Parameter VDS ID @ TA = 25C ID @ TA= 70C IDM PD @TA = 25C PD @TA = 70C EAS VGS TJ, TSTG Drain- Source Voltage Continuous Drain Current, VGS @ -4.5V Continuous Drain Current, VGS @ -4.5V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy Gate-to-Source Voltage Junction and Storage Temperature Range Max. -20 -3.7 -2.2 -22 1.3 0.8 0.01 11 12 -55 to + 150 Units V A W W/C mJ V C Thermal Resistance Parameter RJA Maximum Junction-to-Ambient Typ. 75 Max. 100 Units C/W www.irf.com 1 07/22/08 IRLML6402GPbF Electrical Characteristics @ TJ = 25C (unless otherwise specified) V(BR)DSS V(BR)DSS/TJ Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Min. -20 --- --- --- -0.40 6.0 --- --- --- --- --- --- --- --- --- --- --- --- --- --- Typ. Max. Units Conditions --- --- V VGS = 0V, ID = -250A -0.009 --- V/C Reference to 25C, I D = -1mA 0.050 0.065 VGS = -4.5V, ID = -3.7A 0.080 0.135 VGS = -2.5V, ID = -3.1A -0.55 -1.2 V VDS = VGS, ID = -250A --- --- S VDS = -10V, ID = -3.7A --- -1.0 VDS = -20V, VGS = 0V A --- -25 VDS = -20V, VGS = 0V, TJ = 70C --- -100 VGS = -12V nA --- 100 VGS = 12V 8.0 12 ID = -3.7A 1.2 1.8 nC VDS = -10V 2.8 4.2 VGS = -5.0V 350 --- VDD = -10V 48 --- ID = -3.7A ns 588 --- RG = 89 381 --- RD = 2.7 633 --- VGS = 0V 145 --- pF VDS = -10V 110 --- = 1.0MHz Source-Drain Ratings and Characteristics IS ISM VSD trr Qrr Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Min. Typ. Max. Units --- --- --- --- --- --- --- --- 29 11 -1.3 A -22 -1.2 43 17 V ns nC Conditions MOSFET symbol showing the G integral reverse p-n junction diode. TJ = 25C, IS = -1.0A, VGS = 0V TJ = 25C, IF = -1.0A di/dt = -100A/s D S Notes: max. junction temperature. Pulse width 400s; duty cycle 2%. Repetitive rating; pulse width limited by Surface mounted on 1" square single layer 1oz. copper FR4 board, steady state. Starting TJ = 25C, L = 1.65mH RG = 25, IAS = -3.7A. ** For recommended footprint and soldering techniques refer to application note #AN-994. 2 www.irf.com IRLML6402GPbF 100 VGS -7.00V -5.00V -4.50V -3.50V -3.00V -2.70V -2.50V BOTTOM -2.25V TOP 100 -I D , Drain-to-Source Current (A) -I D , Drain-to-Source Current (A) VGS -7.00V -5.00V -4.50V -3.50V -3.00V -2.70V -2.50V BOTTOM -2.25V TOP 10 10 -2.25V -2.25V 1 0.1 20s PULSE WIDTH TJ = 25 C 1 10 100 1 0.1 20s PULSE WIDTH TJ = 150 C 1 10 100 -VDS , Drain-to-Source Voltage (V) -VDS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 100 2.0 TJ = 25 C RDS(on) , Drain-to-Source On Resistance (Normalized) ID = -3.7A -I D , Drain-to-Source Current (A) 1.5 TJ = 150 C 1.0 0.5 10 2.0 V DS = -15V 20s PULSE WIDTH 3.0 4.0 5.0 6.0 7.0 8.0 -VGS , Gate-to-Source Voltage (V) 0.0 -60 -40 -20 VGS = -4.5V 0 20 40 60 80 100 120 140 160 TJ , Junction Temperature ( C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance Vs. Temperature www.irf.com 3 IRLML6402GPbF 1000 VGS = 0V, f = 1 MHZ Ciss = C + Cgd, C gs ds SHORTED Crss = C gd Coss = C + Cgd ds 10 ID = -3.7A VDS =-10V 800 -VGS , Gate-to-Source Voltage (V) 8 C, Capacitance(pF) Ciss 600 6 400 4 200 Coss Crss 2 0 1 10 100 0 FOR TEST CIRCUIT SEE FIGURE 13 0 3 6 9 12 VDS, Drain-to-Source Voltage (V) QG , Total Gate Charge (nC) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 100 100 -ISD , Reverse Drain Current (A) OPERATION IN THIS AREA LIMITED BY RDS(on) -ID , Drain Current (A) I 10us 10 100us 10 TJ = 150 C 1 1 1ms TJ = 25 C 10ms 0.1 0.2 V GS = 0 V 0.4 0.6 0.8 1.0 1.2 0.1 0.1 TC = 25 C TJ = 150 C Single Pulse 1 10 100 -VSD ,Source-to-Drain Voltage (V) -VDS , Drain-to-Source Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area 4 www.irf.com IRLML6402GPbF 4.0 25 EAS , Single Pulse Avalanche Energy (mJ) -ID , Drain Current (A) 3.0 20 ID -1.7A -3.0A BOTTOM -3.7A TOP 15 2.0 10 1.0 5 0.0 25 50 75 100 125 150 0 TC , Case Temperature ( C) 25 Starting TJ , Junction Temperature ( C) 50 75 100 125 150 Fig 9. Maximum Drain Current Vs. Case Temperature Fig 10. Maximum Avalanche Energy Vs. Drain Current 1000 Thermal Response (Z thJA ) 100 D = 0.50 0.20 10 0.10 0.05 0.02 0.01 1 SINGLE PULSE (THERMAL RESPONSE) Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJA + TA 0.0001 0.001 0.01 0.1 1 10 PDM t1 t2 0.1 0.00001 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com 5 IRLML6402GPbF RDS ( on ) , Drain-to-Source On Resistance ( ) 0.14 0.20 VGS = -2.5V 0.16 RDS(on) , Drain-to -Source Voltage ( ) 0.12 0.10 0.12 0.08 0.06 Id = -3.7A 0.08 VGS = -4.5V 0.04 0.04 0.02 2.0 3.0 4.0 5.0 6.0 7.0 0.00 0 5 10 15 20 25 30 -I D , Drain Current ( A ) -VGS, Gate -to -Source Voltage ( V ) Fig 12. Typical On-Resistance Vs. Gate Voltage Fig 13. Typical On-Resistance Vs. Drain Current 6 www.irf.com IRLML6402GPbF Micro3 (SOT-23) (Lead-Free) Package Outline Dimensions are shown in millimeters (inches) 6 D A 5 DIMENSIONS SYMBOL MILLIMETERS MIN MAX INCHES MIN MAX 3 6 E1 1 2 E 0.15 [0.006] M C B A 5 B e e1 A A2 C H 4 L1 c 0.10 [0.004] C L2 3X L 7 A1 3X b 0.20 [0.008] M C B A A A1 A2 b c D E E1 e e1 L L1 L2 0.89 0.01 0.88 0.30 0.08 2.80 2.10 1.20 0.95 1.90 0.40 0.54 0.25 0 1.12 0.10 1.02 0.50 0.20 3.04 2.64 1.40 BSC BSC 0.60 REF BSC 8 "$ 0.0004 "$ ! " '" #& "& &$ % ! 0 ## # # ! ' ! # $$ 7T8 7T8A !# REF BSC 8 Recommended Footprint 0.972 0.950 NOTES: 1. DIMENSIONING & TOLERANCING PER ANSI Y14.5M-1994 2. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 3. CONTROLLING DIMENSION: MILLIMETER. 4. DATUM PLANE H IS LOCATED AT THE MOLD PARTING LINE. 5. DATUM A AND B TO BE DETERMINED AT DATUM PLANE H. 6. DIMENSIONS D AND E1 ARE MEASURED AT DATUM PLANE H. DIMENSIONS DOES NOT INCLUDE MOLD PROTRUSIONS OR INTERLEAD FLASH. MOLD PROTRUSIONS OR INTERLEAD FLASH SHALL NOT EXCEED 0.25 MM [0.010 INCH] PER SIDE. 7. DIMENSION L IS THE LEAD LENGTH FOR SOLDERING TO A SUBSTRATE. 8. OUTLINE CONFORMS TO JEDEC OUTLINE TO-236 AB. 0.802 2.742 1.900 Micro3 (SOT-23 / TO-236AB) Part Marking Information Micro3 / SOT-23 Package Marking XA2A !%ADAAQS@8@9@9A7AG6TUA9DBDUAPAA86G@I96SA@6S Y = YEAR W = WEEK PART NUMBER A YW LC HALOGEN FREE INDICATOR LOT CODE @6S ! !! !" !# !$ !% !& !' !( ! ! " # $ % & ' ( XPSF X@@F ! " # X 6 7 8 9 PART NUMBER CODE REFERENCE: A = IRLML2402 B =IRLML2803 C = IRLML2402 D = IRLML5103 E = IRLML6402 F = IRLML6401 G = IRLML2502 H = IRLML5203 Note: A line above the work week (as shown here) indicates Lead-free !# !$ !% XPSF X@@F !& !' !( " Y a XA2A!&$!ADAAQS@8@9@9A7A6AG@UU@S @6S ! !! !" !# !$ !% !& !' !( ! 6 7 8 9 @ A B C E F X 6 7 8 9 $ $ $! Y a Note: For the most current drawing please refer to IR website at http://www.irf.com/package www.irf.com 7 IRLML6402GPbF Micro3TM Tape & Reel Information Dimensions are shown in millimeters (inches) 2.05 ( .080 ) 1.95 ( .077 ) 4.1 ( .161 ) 3.9 ( .154 ) 1.6 ( .062 ) 1.5 ( .060 ) 1.85 ( .072 ) 1.65 ( .065 ) 1.32 ( .051 ) 1.12 ( .045 ) TR 3.55 ( .139 ) 3.45 ( .136 ) 8.3 ( .326 ) 7.9 ( .312 ) FEED DIRECTION 4.1 ( .161 ) 3.9 ( .154 ) 1.1 ( .043 ) 0.9 ( .036 ) 0.35 ( .013 ) 0.25 ( .010 ) 178.00 ( 7.008 ) MAX. 9.90 ( .390 ) 8.40 ( .331 ) NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. Note: For the most current drawing please refer to IR website at http://www.irf.com/package Data and specifications subject to change without notice. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 07/2008 8 www.irf.com |
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